Track 6: Smart Microsystems & High-End MEMS Sensors

The development of smart microsystems and MEMS technology has become a global research hotspot. By integrating microelectromechanical systems with CMOS technology, multifunctional systems can achieve compact sizing, low cost, and miniaturization, while realizing high intelligence through ultra-high-performance processing and computing. Current research predominantly focuses on high-end chip development, smart sensor manufacturing, heterogeneous microsystem integration, multi-source signal processing, and execution strategies. This track aims to explore technical applications and advancements in embodied intelligence, ubiquitous sensing, multi-modal fusion, precise guidance, and high-precision sensing, while discussing common challenges, emerging trends, and the profound significance of future microsystem paradigms.

智能微系统与 MEMS 技术发展是当前世界各国研究热点，通过将微机电系统与 CMOS 技术等整合，实现小体积、低成本、微型化的多功能系统，并通过超高性能处理与计算等实现智能化。目前研究热点多围绕高端芯片开发、智能传感器制造、微系统异质异构集成、多源信号处理与执行策略等，本次会议旨在探索该技术在具身智能、泛在感知、多模融合、精确制导、高精度传感等方面的技术应用和发展，旨在讨论微系统发展所面临的共性问题、发展趋势与深远意义。